The U.S. Department of Commerce’s Bureau of Industry and Security (BIS) announced on Tuesday new export control restrictions aimed at stymieing China’s efforts to become a global tech power.
The agency said the new controls are designed to “further impair” China’s ability to produce semiconductors that can be used for military applications.
The new restrictions apply to 24 types of semiconductor manufacturing equipment and three types of software tools used to develop and produce chips. The controls will also target high-bandwidth memory (HBM), which is a key component of advanced computing integrated circuits (ICs) and artificial intelligence (AI).
“This action builds on BIS’s laser-focused work, undertaken over the past few years, to impose strategic controls that have hindered the [People’s Republic of China’s] ability to produce advanced semiconductors and AI capabilities directly impacting U.S. national security,” said Under Secretary of Commerce for Industry and Security Alan Estevez.
As part of this effort, BIS also said that it was adding 140 entities to its entity list, including semiconductor fabrication facilities, tool companies, and investment firms that are acting on behalf of China to help it advance its goals in the chip industry.
“The purpose of these entity list actions is to stop [People’s Republic of China] companies from leveraging U.S. technology to indigenously produce advanced semiconductors,” said Matthew Axelrod, Assistant Secretary for Export Enforcement at BIS.
BIS said these actions are intended to slow down China’s development of advanced AI that has the potential to impact the future of warfare.
The new restrictions follow a recent meeting between President Biden and China's leader Xi Jinping. The two leaders met in mid-November on the sidelines of the annual Asia-Pacific Economic Cooperation summit, where they discussed some of the most pressing issues, including China’s involvement in supporting Russia in its war against Ukraine.
The agency said the new controls are designed to “further impair” China’s ability to produce semiconductors that can be used for military applications.
The new restrictions apply to 24 types of semiconductor manufacturing equipment and three types of software tools used to develop and produce chips. The controls will also target high-bandwidth memory (HBM), which is a key component of advanced computing integrated circuits (ICs) and artificial intelligence (AI).
“This action builds on BIS’s laser-focused work, undertaken over the past few years, to impose strategic controls that have hindered the [People’s Republic of China’s] ability to produce advanced semiconductors and AI capabilities directly impacting U.S. national security,” said Under Secretary of Commerce for Industry and Security Alan Estevez.
As part of this effort, BIS also said that it was adding 140 entities to its entity list, including semiconductor fabrication facilities, tool companies, and investment firms that are acting on behalf of China to help it advance its goals in the chip industry.
“The purpose of these entity list actions is to stop [People’s Republic of China] companies from leveraging U.S. technology to indigenously produce advanced semiconductors,” said Matthew Axelrod, Assistant Secretary for Export Enforcement at BIS.
BIS said these actions are intended to slow down China’s development of advanced AI that has the potential to impact the future of warfare.
The new restrictions follow a recent meeting between President Biden and China's leader Xi Jinping. The two leaders met in mid-November on the sidelines of the annual Asia-Pacific Economic Cooperation summit, where they discussed some of the most pressing issues, including China’s involvement in supporting Russia in its war against Ukraine.
